SUBSTRATE WITH METAL WIRING FOR POWER MODULES, POWER MODULE, SUBSTRATE FOR POWER MODULES, AND METHOD FOR PRODUCING SUBSTRATE WITH METAL WIRING FOR POWER MODULES

摘要

Provided is a power module on which a power semiconductor element is mounted, and which has improved heat dissipation performance and improved reliability by means of a substrate for power modules, wherein a polyimide resin layer is formed on a metal substrate so as to achieve both electrical insulation and thermal conductivity, a substrate with metal wiring for power modules, which uses this substrate for power modules, and a method for producing a substrate with metal wiring for power modules. A substrate with metal wiring for power modules, which comprises at least a metal substrate, a polyimide resin layer and a conductive metal wiring layer is characterized in that the polyimide resin layer is formed in a pattern on the metal substrate, and is also characterized by a power module which uses this substrate with metal wiring for power modules, a substrate for power modules for this substrate with metal wiring for power modules, and a method for producing a substrate with metal wiring for power modules.