| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can stabilize wire bondability and improve a heat dissipation performance.SOLUTION: A semiconductor device manufacturing method comprises: die bonding a switching element 4 to a first region 5a of a lead frame 5; die bonding a driving element 6 for driving the switching element 4 to a second region 5b of the lead frame 5; placing the lead frame 5 on a heater plate 2 and bonding Au wires 9 to the driving element 6 while heating the second region 5b of the lead frame 5 and the driving element 6; and attaching an insulation sheet 10 to a rear face of the first region of the lead frame 5 after bonding the Au wires 9 to the driving element 6. When the lead frame 5 is placed on the heater plate 2, the first region 5a of the lead frame 5 is arranged on a recess 8 provided on a top face of the heater plate 2. |
