发明名称 |
SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURE THEREOF |
摘要 |
A semiconductor device includes: leads (5) in each of which a cutout (5a) is formed; a die pad (11); a power element (1) held on the die pad (11); and a package (6) made of a resin material, and configured to encapsulate inner end portions of the leads (5), and the die pad (11) including the power element (1). The cutout (5a) is located in a region of each of the leads (5) including a portion of the lead (5) located at a boundary between the lead (5) and the package (6), and is filled with a resin material. |
申请公布号 |
EP2677539(A4) |
申请公布日期 |
2016.03.30 |
申请号 |
EP20120746473 |
申请日期 |
2012.01.19 |
申请人 |
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
发明人 |
MINAMIO, MASANORI |
分类号 |
H01L23/48;H01L23/28;H01L23/50;H01L25/07;H01L25/18 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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