发明名称 Light emitting diode and light emitting diode package having the same
摘要 Disclosed are: a light emitting diode, a light emitting diode package and a light emitting module. The light emitting diode (106) includes a light emitting structure (120) including a first conductive semiconductor layer (115), a second conductive semiconductor layer (119) and an active layer (117) between the first and second conductive semiconductor layers; a support member (151) under the light emitting structure; a reflective electrode layer (131) between the second conductive semiconductor layer and the support member; and first to third connection electrodes (141, 143, 145) spaced apart from each other in the support member. The second connection electrode (143) is disposed between the first and third connection electrodes (141, 145), the first and third connection electrodes are electrically connected with each other, and the support member (151) is disposed at a peripheral portion of the first to third connection electrodes.
申请公布号 EP2613370(A3) 申请公布日期 2016.03.30
申请号 EP20130150058 申请日期 2013.01.02
申请人 LG INNOTEK CO., LTD. 发明人 BAE, SEOK HUN;CHOI, SEOK BEOM;KANG, PIL GEUN;HWANG, DEOK KI;HAN, YOUNG JU;CHOI, HEE SEOK;PARK, YOUNG ROK;LEE, TAE DON;OH, HYUN SUNG;JOO, JEE HUE;KANG, DONG WOO;KIM, SUNG SIG
分类号 H01L33/48;H01L33/20;H01L33/38;H01L33/40;H01L33/44;H01L33/62;H01L33/64 主分类号 H01L33/48
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