| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which suppresses the increase of the manufacturing cost.SOLUTION: An electronic component includes: a mounting substrate 200; an elastic surface wave device 100 mounted on an upper surface of the mounting substrate 200; a first electrode layer 310 formed on a rear surface of the mounting substrate 200 and electrically connecting with the elastic surface wave device 100; and a resist pattern 400 formed on a rear surface of the mounting substrate so as to cover a part of the first electrode layer 310. The first electrode layer 310 includes multiple rear surface electrodes 310a to 310i, and the rear surface electrodes 310a to 310h are formed by two electrode parts sharing a part with each other. The resist pattern 400 is opened so as to form a window shaped opening so that the entire part of one of the two electrode parts is exposed. |
