RFID devices and methods for manufacturing

摘要

A RFID device includes a substrate, a conductive element, and a RFID chip. The conductive element is coupled to the substrate and defines at least one pathway. The RFID chip includes an integrated circuit, a terminal, and an electrical lead connecting the integrated circuit and the terminal. The terminal is in electrical communication with the conductive element. The RFID chip is positioned so that a first portion of the RFID chip is positioned above the conductive element and a second portion of the RFID chip is positioned above the at least one pathway. Methods are also provided.

主权项

1. A RFID (Radio Frequency Identification) device mounted proximate to a metal object, comprising:
a RFID inlay, the inlay having a substrate, a conductive element, and a RFID chip; the conductive element having a plurality of legs and is provided on the substrate and defines at least one pathway; the RFID chip includes an integrated circuit, a terminal and an electrical lead connecting the integrated circuit and the terminal; the terminal is in electrical communication with the conductive element; the RFID device is positioned so that a first portion of the RFID device is positioned about the conductive element and a second portion of the RFID device is positioned above the at least one pathway; and wherein size, shape, and arrangement of both the conductive element and the at least one pathway acts to balance a decrease in inductance and an increase in capacitance of the RFID device when positioned in close proximity to the metal object.