Packaging methods for semiconductor devices

摘要

Methods of packaging semiconductor devices are disclosed. In one embodiment, a packaging method for semiconductor devices includes providing a workpiece including a plurality of first dies, and coupling a plurality of second dies to the plurality of first dies. The plurality of second dies and the plurality of first dies are partially packaged and separated. Top surfaces of the second dies are coupled to a carrier, and the partially packaged plurality of second dies and plurality of first dies are fully packaged. The carrier is removed, and the fully packaged plurality of second dies and plurality of first dies are separated.

主权项

1. A packaging method for semiconductor devices, the method comprising:
providing a workpiece including a plurality of first dies; coupling a plurality of second dies to each one of the plurality of first dies; forming an underfill between the respective pluralities of second dies and the respective ones of the plurality of first dies; singulating individual partially packaged second dies and first dies; coupling top surfaces of the plurality of second dies to a carrier; fully packaging the partially packaged plurality of second dies and plurality of first dies; removing the carrier; and singulating individual fully packaged second dies and first dies.