Sputtering apparatus

摘要

A sputtering apparatus includes a target electrode capable of mounting a target, a first support member which supports the target electrode, a magnet unit which forms a magnetic field on a surface of the target, a second support member which supports the magnet unit, and a force generation portion which is provided between the first support member and the second support member, and generates a second force in a direction opposite to a first force that acts on the second support member by an action of the magnetic field formed between the target and the magnet unit, wherein the second force has a magnitude which increases as the magnet unit comes closer to the target electrode.

主权项

1. A sputtering apparatus comprising:
a target electrode capable of mounting a target; a first support which supports the target electrode; a magnet unit which forms a magnetic field on a surface of the target; a second support which supports the magnet unit, the second support including a motor configured to rotate a first shaft connected to the magnet unit so as to rotate the magnet unit, and a driving base configured to support the motor, the magnet unit being supported by the motor via the first shaft, wherein the magnetic field creates a first force urging the driving base of the second support in a first direction; a driving unit which includes a second shaft connected to the motor and moves the second shaft so as to move the motor vertically such that the magnetic unit is moved vertically, the driving unit configured so as to increase a distance between the magnetic unit and the target; and a force generation portion which is provided between the first support and the driving base of the second support, and generates a second force, the second force urges the driving base of the second support in a second direction that is opposite to the first direction, the force generation portion being configured so as to assist the driving unit in increasing the distance between the magnetic unit and the target; wherein the second force has a magnitude which increases as the magnet unit comes closer to the target electrode; wherein the force generation portion is one of a spring, a magnet, and an elastic member.