Hybrid-integrated photonic chip package with an interposer

摘要

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.

主权项

1. A chip package, comprising:
an integrated circuit having a front surface with integrated-circuit connector pads; integrated-circuit electrical connectors electrically coupled to the integrated-circuit connector pads; an interposer having a top surface, facing the front surface of the integrated circuit, with first interposer connector pads, electrically coupled to the integrated-circuit electrical connectors, and second interposer connector pads; input/output (I/O)-integrated-circuit electrical connectors electrically coupled to the second interposer connector pads; an I/O integrated circuit having a front surface, facing the top surface, with first I/O-integrated-circuit connector pads electrically coupled to the I/O-integrated-circuit electrical connectors, and second I/O-integrated-circuit connector pads, wherein the I/O integrated circuit is proximate to the integrated circuit on a same side of the interposer, and wherein the I/O integrated circuit includes electrical I/O circuits and optical driver and receiver circuits; optical-integrated-circuit electrical connectors electrically coupled to the second I/O-integrated-circuit connector pads; and an optical integrated circuit having a top surface, facing the front surface of the I/O integrated circuit, with optical-integrated-circuit connector pads electrically coupled to the optical-integrated-circuit electrical connectors, wherein the optical integrated circuit is configured to communicate optical signals; wherein the optical integrated circuit is placed adjacent to the interposer, and wherein a part of the I/O integrated circuit extends beyond an edge of the interposer to dispose on top of the optical integrated circuit.