| 摘要 |
A leadframe-type packaged laser diode is provided, in which the laser diode chip is electrically decoupled from the package. A leadframe-type package including a two-dimensional grid of electrodes encapsulated in a molded plastic framework allows batch processing of one- or two-dimensional arrays of leadframes, the batch processing including laser diode chips attachment, wirebonding, and packaging, with subsequent breakout of individual packaged laser diodes from the one- or two-dimensional array. |
| 主权项 |
1. A packaged laser diode comprising:
a leadframe comprising a thermally and electrically conductive floor plate, first and second electrodes, and a plastic framework supporting therein the floor plate, the first electrode, and the second electrode, wherein the plastic framework electrically insulates the floor plate, the first electrode, and the second electrode from each other; the plastic framework including a bottom portion having therein or thereon the floor plate, the bottom portion having first to fourth perimeter sides and a sidewall extending from the bottom portion on at least the first to third perimeter sides in a direction substantially perpendicular to the floor plate, thereby defining a protective compartment space with the floor plate at the bottom; a laser diode chip mounted on the floor plate and at least partially disposed within the protective compartment space, the laser diode chip having front and rear facets, the front facet facing the fourth perimeter side for outputting a laser beam generated by the laser diode chip, wherein in operation, the floor plate supports and conducts away heat generated by the laser diode chip; and first and second wirebonds connecting the first and second electrodes, respectively, to the laser diode chip, for supplying electric current thereto for generating the laser beam, wherein the first and second wirebonds are disposed within the protective compartment space. |
