PLATING APPARATUS

摘要

The present invention relates to a plating apparatus which can evenly perform plating all around a material to be plated. To this end, according to an embodiment of the present invention, the plating apparatus comprises: a plating bath; and a plating solution supply unit for forming a flow of a plating solution by supplying the plating solution to the inside of the plating bath, and collecting the plating solution at the same time. In addition, the plating solution supply unit includes: a plating solution supply line, a plating solution collection line, and an agitation unit.