Method for manufacturing PCB

摘要

A method for manufacturing a printed circuit board is disclosed, which comprises the following steps. A basic board having an upper surface and a bottom surface opposite to the upper surface is provided. A plurality of the electronic components temporarily disposed on the basic board is provided. At least one locating pin temporarily disposed on a place of the basic board is provided, in which the electronic components are not temporarily disposed on the place. Surface mount technology is used simultaneously to joint at least one locating pin and the electronic components on the basic board.

主权项

1. A method for manufacturing a printed circuit board, comprising:
providing a basic board having an upper surface and a bottom surface opposite to the upper surface; providing a plurality of the electronic components temporarily disposed on the basic board; providing at least two locating pins temporarily disposed on the basic board, wherein the locating pins are disposed at two opposite corners of the basic board where the electronic components aren't temporarily disposed at; and simultaneously jointing the at least two locating pins and the electronic components on the basic board; wherein the step of simultaneously jointing the at least two locating pins and the electronic components on the basic board comprises:
soldering the at least two locating pins and the electronic components on the basic board by the way of roast or solder reflow.