CONTROL OF WARPAGE USING ABF GC CAVITY FOR EMBEDDED DIE PACKAGE

摘要

Embodiments include semiconductor device packages and methods of forming such packages. In an embodiment, the package may include a die-side reinforcement layer with a cavity formed through the die-side reinforcement layer. A die having a first side and an opposite second side comprising a device side may be positioned in the cavity with the first side of the die being substantially coplanar with a first side of the die-side reinforcement layer. In an embodiment, a build-up structure may be coupled to a second side of the die. Embodiments include a build-up structure that includes a plurality of alternating layers of patterned conductive material and insulating material.

主权项

1. A device package comprising:
a die-side reinforcement layer having a first side and an opposite second side, wherein a cavity is formed through the die-side reinforcement layer; a die having a first side and an opposite second side comprising a device side with contacts, wherein the die is positioned in the cavity with the first side of the die being substantially coplanar with the first side of the die-side reinforcement layer; and a build-up structure coupled to a second side of the die, the build-up structure comprising a plurality of alternating layers of patterned conductive material and insulating material, wherein at least one of the layers of patterned conductive material is coupled to one of the contact points of the die.