PROXIMITY CONTACT COVER RING FOR PLASMA DICING

摘要

Methods of and carriers for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a cover ring for protecting a carrier and substrate assembly during an etch process includes an inner opening having a diameter smaller than the diameter of a substrate of the carrier and substrate assembly. An outer frame surrounds the inner opening. The outer frame has a bevel for accommodating an outermost portion of the substrate of the carrier and substrate assembly.

主权项

1. A cover ring for protecting a carrier and substrate assembly during an etch process, the cover ring comprising:
an inner opening having a diameter smaller than the diameter of a substrate of the carrier and substrate assembly; and an outer frame surrounding the inner opening, the outer frame having a bevel for accommodating an outermost portion of the substrate of the carrier and substrate assembly, wherein the bevel comprises an overhanging surface and a peripheral surface, wherein the overhanging surface of the bevel is for contacting an upper surface of the outermost portion of the substrate of the carrier and substrate assembly, wherein the peripheral surface of the bevel is sized and oriented to substantially face a peripheral surface of the outermost portion of the substrate of the carrier and substrate assembly, but not contact the peripheral surface of the outermost portion of the substrate, and wherein the outer frame is sized to fit within a frame of the carrier and substrate assembly.