| 发明名称 |
Differential Pressure Sensor Assembly |
| 摘要 |
A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance. |
| 申请公布号 |
US2016084722(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201414495095 |
申请日期 |
2014.09.24 |
| 申请人 |
Hooper Stephen R.;Frear Darrel R.;Speight Thomas C. |
发明人 |
Hooper Stephen R.;Frear Darrel R.;Speight Thomas C. |
| 分类号 |
G01L9/00 |
主分类号 |
G01L9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A differential pressure sensor assembly comprising:
a transducer having a first sensing surface and a second sensing surface, the second sensing surface contained in a cavity; an Integrated Circuit (IC) hermetically coupled to the transducer, the IC having a first aperture aligned to the cavity; a lead frame coupled to the IC, the lead frame having a second aperture aligned to the first aperture of the IC; and a package encapsulating the transducer, the IC and the lead frame, the package having a third aperture exposed to the first sensing surface, the package including a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC, and the molding compound separated from the transducer by an encroachment distance. |
| 地址 |
Mesa AZ US |
