| 发明名称 |
SCHEDULING APPLICATIONS IN PROCESSING DEVICES BASED ON PREDICTED THERMAL IMPACT |
| 摘要 |
A processing device includes a plurality of components and a system management unit to selectively schedule an application phase to one of the plurality of components based on one or more comparisons of predictions of a plurality of thermal impacts of executing the application phase on each of the plurality of components. The predictions may be generated based on a thermal history associated with the application phase, thermal sensitivities of the plurality of components, or a layout of the plurality of components in the processing device. |
| 申请公布号 |
US2016085219(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201414493189 |
申请日期 |
2014.09.22 |
| 申请人 |
Advanced Micro Devices, Inc. |
发明人 |
Paul Indrani;Arora Manish;Eckert Yasuko;Manne Srilatha |
| 分类号 |
G05B15/02;G06N5/04 |
主分类号 |
G05B15/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
selectively scheduling an application phase to one of a plurality of components of a processing device based on at least one comparison of predictions of a plurality of thermal impacts of executing the application phase on each of the plurality of components. |
| 地址 |
Sunnyvale CA US |
