INTEGRATED CHIP PACKAGE WITH OPTICAL INTERFACE

摘要

A chip package includes an integrated circuit and an optical integrated circuit (such as a hybrid integrated circuit) with an optical source and/or an optical receiver. The integrated circuit and the optical integrated circuit may be proximate to each other on opposite sides of an interposer in the chip package. Moreover, the integrated circuit may include a driver circuit of electrical signals for the optical source and/or a receiver circuit of electrical signals from the optical receiver. Furthermore, the optical integrated circuit may be positioned in a hole or an etch pit in a substrate, and an alignment feature may mechanically couple the substrate to an optical-fiber assembly, so that the optical-fiber assembly is positioned relative to the interposer and the optical integrated circuit. In particular, the optical-fiber assembly may partially overlap the interposer, so that optical signals are provided and/or received from the optical integrated circuit through the interposer.

主权项

1. A chip package, comprising:
an integrated circuit having an end and a front surface with an integrated-circuit connector pad, wherein the integrated circuit includes at least one of: a driver circuit of an electrical signal for an optical source in an optical integrated circuit, and a receiver circuit of a second electrical signal from an optical receiver in the optical integrated circuit; an integrated-circuit electrical connector electrically coupled to the integrated-circuit connector pad; an interposer having an end, a top surface and a bottom surface, wherein the end of the interposer is horizontally displaced from the end of the integrated circuit, wherein the top surface faces the front surface and has a first interposer connector pad electrically coupled to the integrated-circuit electrical connector, and wherein the bottom surface is on an opposite side of the interposer from the top surface and has a second interposer connector pad electrically coupled to the first interposer connector pad by a via through the interposer, wherein the interposer includes an optical component to focus optical signal, and wherein the optical component comprises one of the following: a lens, a diffraction element, and a mirror; an optical-integrated-circuit electrical connector electrically coupled to the second interposer connector pad; the optical integrated circuit having a front surface, facing the bottom surface of the interposer, with an optical-integrated-circuit connector pad electrically coupled to the optical-integrated-circuit electrical connector, wherein the optical integrated circuit includes at least one of: the optical source configured to output an optical signal based on the electrical signal, and the optical receiver configured to receive a second optical signal and to output the second electrical signal; and an optical-fiber assembly having an end facing the end of the integrated circuit and positioned above the interposer and the optical integrated circuit, wherein the optical-fiber assembly partially overlaps the interposer, and wherein the optical integrated circuit is positioned so that at least one of: the optical signal is provided to the optical-fiber assembly passing through the interposer between the top surface and the bottom surface, and the second optical signal is received from the optical-fiber assembly and is provided to the optical integrated circuit passing through the interposer between the top surface and the bottom surface.