SEMICONDUCTOR DEVICES INCLUDING THROUGH-SILICON-VIAS AND METHODS OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGES INCLUDING THE SEMICONDUCTOR DEVICES

摘要

A semiconductor device can include a substrate that has a surface. A via structure can extend through the substrate toward the surface of the substrate, where the via structure includes an upper surface. A pad structure can be on the surface of the substrate, where the pad structure can include a lower surface having at least one protrusion that is configured to protrude toward the upper surface of the via structure.

主权项

1. A semiconductor device, comprising:
a via structure through a substrate, a portion of the via structure exposed above a top surface of the substrate, and the via structure having a top surface of which a central portion is concave and including:
a via electrode including a conductive pattern and a barrier layer pattern surrounding a sidewall of the conductive pattern; andan insulation layer pattern surrounding a sidewall of the via electrode, wherein a top surface of the conductive pattern is lower than that of the insulation layer pattern and is flat, a protection layer pattern structure on the top surface of the substrate, the protection layer pattern structure surrounding a sidewall of the portion of the via structure that is exposed and including a photosensitive organic material; and a pad structure contacting a top surface of the portion of the via structure that is exposed, the pad structure having a flat top surface.