WORKPIECE POLISHING APPARATUS

摘要

A workpiece polishing apparatus including a polishing pad to polish a workpiece, a polishing agent supplying mechanism to supply a polishing agent, and a polishing head to hold the workpiece such that a back surface of the workpiece is held by a backing pad and an edge of the workpiece is held by an annular template. This apparatus polishes the workpiece by pressing the workpiece and the template against the polishing pad and thereby bringing the workpiece into sliding contact with the polishing pad. The template is made of a resin containing filler or woven fabric and has fine depressions created by filler or woven fabric exposed on the surface on the side that presses the polishing pad. This apparatus can stabilize the polishing rate of the outer circumferential portion of the workpiece and thereby polish the workpiece into a very flat workpiece.