发明名称 積層研磨パッドの製造方法
摘要 A method for producing a laminated polishing pad, which is free from warpage and does not cause peeling between a polishing layer and a cushion layer during polishing, includes the steps of: laminating a hot-melt adhesive sheet to a surface of a cushion layer with a base material in which a thermoplastic resin base material is provided peelably on one surface of the cushion layer, on which the thermoplastic resin base material is not provided; heating the laminated hot-melt adhesive sheet to be melted or softened; laminating a polishing layer on the melted or softened hot-melt adhesive to prepare a laminate; cutting the laminate to the size of the polishing layer to prepare a laminated polishing sheet; and peeling the thermoplastic resin base material from the laminated polishing sheet.
申请公布号 JP5893413(B2) 申请公布日期 2016.03.23
申请号 JP20120007220 申请日期 2012.01.17
申请人 東洋ゴム工業株式会社 发明人 中井 良之
分类号 B24B37/11;H01L21/304 主分类号 B24B37/11
代理机构 代理人
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