| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which eliminates contact between semiconductor element connection pads and bubbles in a sealing resin thereby achieving good electrical insulation between the semiconductor element connection pads arranged parallel to each other.SOLUTION: A wiring board 10 includes: an insulation substrate 1 having a mounting part 1a, on which a semiconductor element S is mounted, at a center part on an upper surface; multiple wiring conductors 2 located adjacent to each other at an outer peripheral part of the mounting part 1a on the upper surface of the insulation substrate 1 and extending in a direction perpendicular to an outer periphery of the semiconductor element S; and a solder resist layer 3 which is deposited on the upper surface of the insulation substrate 1, has an opening 3a exposing parts of the wiring conductors 2 at the outer peripheral part as multiple semiconductor element connection pads 4 which are arranged parallel to each other along the outer periphery, and coats the other part of the wiring conductors 2. In the opening 3a, a cutout part 7, which reduces its width toward an intermediate position between the semiconductor element connection pads 4, is formed at an opening edge 6 between the semiconductor element connection pads 4 arranged parallel to each other. |
