发明名称 SEMICONDUCTOR LASER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor laser device which can favorably reduce noise input to a semiconductor laser chip.SOLUTION: A semiconductor laser device 1 comprises: a chip carrier 2; a first metalization which is provided on the chip carrier 2 and has a chip mounting region 3a and first and second regions 3b, 3c extending from the chip mounting region 3a; a second metalization which is provided on the chip carrier 2 and isolated from the first metalization and to which a direct current is input; a solder material pattern 15 continuously provided on the chip mounting region 3a and the second region 3c in the first metalization; a semiconductor laser chip 12 which is mounted on the chip mounting region 3a via the solder material pattern 15 and connected to the second metalization; and a capacitor 14 in which one electrode is connected to the first region 3b and the other electrode is connected to the second metalization.SELECTED DRAWING: Figure 1
申请公布号 JP2016039304(A) 申请公布日期 2016.03.22
申请号 JP20140162643 申请日期 2014.08.08
申请人 SUMITOMO ELECTRIC DEVICE INNOVATIONS INC 发明人 OKA YOSHIKI;NAKAZAWA TAKASHI;MIYATA MITSUYOSHI;KAWAMURA HIROMITSU
分类号 H01S5/022;H01S5/042;H01S5/06 主分类号 H01S5/022
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