发明名称 |
SEMICONDUCTOR LASER DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device which can favorably reduce noise input to a semiconductor laser chip.SOLUTION: A semiconductor laser device 1 comprises: a chip carrier 2; a first metalization which is provided on the chip carrier 2 and has a chip mounting region 3a and first and second regions 3b, 3c extending from the chip mounting region 3a; a second metalization which is provided on the chip carrier 2 and isolated from the first metalization and to which a direct current is input; a solder material pattern 15 continuously provided on the chip mounting region 3a and the second region 3c in the first metalization; a semiconductor laser chip 12 which is mounted on the chip mounting region 3a via the solder material pattern 15 and connected to the second metalization; and a capacitor 14 in which one electrode is connected to the first region 3b and the other electrode is connected to the second metalization.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016039304(A) |
申请公布日期 |
2016.03.22 |
申请号 |
JP20140162643 |
申请日期 |
2014.08.08 |
申请人 |
SUMITOMO ELECTRIC DEVICE INNOVATIONS INC |
发明人 |
OKA YOSHIKI;NAKAZAWA TAKASHI;MIYATA MITSUYOSHI;KAWAMURA HIROMITSU |
分类号 |
H01S5/022;H01S5/042;H01S5/06 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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