| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage on a semiconductor wafer caused by poor cutting of a protective tape.SOLUTION: A protective tape T is pasted to a semiconductor wafer W mounted on a holding table 5, and then the protective tape T is cut while running a cutter blade 12 piercing the protective tape T along the outer shape of the semiconductor wafer W. In the cutting process, poor cutting of the protective tape T is inspected by tracking a detector 47 from the rear of the cutter blade 12. When poor cutting is detected by inspection results, unnecessary protective tape T', cut out in the shape of the semiconductor wafer W, is peeled after cutting the protective tape T again.SELECTED DRAWING: Figure 2 |
