| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate bonding method and a substrate bonding device, which can bond a reinforcement support plate and a wafer with high accuracy even though a device configuration is simplified.SOLUTION: A substrate bonding method comprises the steps of: holding a wafer W on a holding table 37 arranged inside a lower housing 33B of a pair of housings which compose a chamber 7; holding a support plate G by a compressing member 61 arranged inside an upper housing 33A and making the wafer W and the support plate G face each other; attaching a double-sided adhesive tape T larger than an outer shape of the housing to a bonding part of the lower housing 33B; attaching the double-sided adhesive tape while decreasing atmospheric pressure of a space including any of the wafer W and the support plate G which are arranged to closely face an adhesive face of the double-sided adhesive tape T to lower pressure than that of another space in a state where the upper and lower housings 33A, 33B are joined with the double-sided adhesive tape T being sandwiched; subsequently lowering the compressing member 61 to attach the support plate G to the double-sided adhesive tape; and opening the chamber 7 and cutting the double-sided adhesive tape along an outer shape of the support plate G.SELECTED DRAWING: Figure 1 |
