发明名称 固相拡散または相変態を用いた接続層による恒久的なウエハ結合方法
摘要 A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.
申请公布号 JP5889411(B2) 申请公布日期 2016.03.22
申请号 JP20140527503 申请日期 2011.08.30
申请人 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 发明人 クラウス・マルティンシッツ;マルクス・ヴィンプリンガー;ベルンハルト・レブハン;クルト・ヒンゲル
分类号 H01L21/02;B23K20/00;H01L21/60 主分类号 H01L21/02
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