| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in which: a void may remain in a laminate laminated with a substrate.SOLUTION: A substrate lamination device laminates a first substrate including a first region used as an electric conduction path and a second region not used as the electric conduction path on a second substrate different from the first substrate. The substrate comprises a pressurization unit in which a recess formed in the region including a structure in the first substrate pressurizes the first and second substrates superposed with each other by the pressure for bringing the first substrate into contact with the surface facing the first substrate in the second substrate.SELECTED DRAWING: Figure 15 |
