| 发明名称 | Optoelectronic component and method for operating an optoelectronic component | ||
| 摘要 | An optoelectronic component includes a carrier on which at least one first light-emitting semiconductor chip and one first light-absorbing semiconductor chip connected antiparallel to the at least one first light-emitting semiconductor chip, at least one second light-emitting semiconductor chip and one second light-absorbing semiconductor chip connected antiparallel to the at least one second light-emitting semiconductor chip, wherein the semiconductor chips are arranged on the carrier such that light from each light-emitting semiconductor chip falls on at least one of the light-absorbing semiconductor chips not connected to the respective light-emitting semiconductor chip, and the light-absorbing semiconductor chips are formed as protection diodes. | ||
| 申请公布号 | US9293629(B2) | 申请公布日期 | 2016.03.22 |
| 申请号 | US201214007098 | 申请日期 | 2012.03.19 |
| 申请人 | OSRAM Opto Semiconductors GmbH | 发明人 | Wicke Markus |
| 分类号 | H01L31/153;H01L25/16;H01L25/075 | 主分类号 | H01L31/153 |
| 代理机构 | DLA Piper LLP (US) | 代理人 | DLA Piper LLP (US) |
| 主权项 | 1. An optoelectronic component comprising: a carrier on which at least one first light-emitting semiconductor chip and one first light-absorbing semiconductor chip connected antiparallel to the at least one first light-emitting semiconductor chip, at least one second light-emitting semiconductor chip and one second light-absorbing semiconductor chip connected antiparallel to the at least one second light-emitting semiconductor chip, wherein the semiconductor chips are arranged on the carrier such that light from each light-emitting semiconductor chip falls on at least one of the light-absorbing semiconductor chips not connected to the respective light-emitting semiconductor chip, and the light-absorbing semiconductor chips are formed as protection diodes. | ||
| 地址 | DE | ||