发明名称 |
Crystallization processing for semiconductor applications |
摘要 |
A method and apparatus for forming a crystalline semiconductor layer on a substrate are provided. A semiconductor layer is formed by vapor deposition. A pulsed laser melt/recrystallization process is performed to convert the semiconductor layer to a crystalline layer. Laser, or other electromagnetic radiation, pulses are formed into a pulse train and uniformly distributed over a treatment zone, and successive neighboring treatment zones are exposed to the pulse train to progressively convert the deposited material to crystalline material. |
申请公布号 |
US9290858(B2) |
申请公布日期 |
2016.03.22 |
申请号 |
US201414495533 |
申请日期 |
2014.09.24 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
Moffatt Stephen |
分类号 |
C30B13/24;H01L21/02;H01L31/18;H01L21/263;H01L21/268;C30B29/40;H01L29/68;H01L33/00 |
主分类号 |
C30B13/24 |
代理机构 |
Patterson & Sheridan, LLP |
代理人 |
Patterson & Sheridan, LLP |
主权项 |
1. A method of treating a substrate, comprising:
identifying a first treatment zone; forming a molten area of the first treatment zone by exposing a surface of the first treatment zone to a first laser pulse, wherein the first laser pulse has a non-uniformity of less than about 5 percent; recrystallizing the molten area of the first treatment zone while exposing the first treatment zone to a first plurality of laser pulses; identifying a second treatment zone; forming a molten area of the second treatment zone by exposing a surface of the second treatment zone to a second laser pulse, wherein the second laser pulse has a non-uniformity of less than about 5 percent; and recrystallizing the molten area of the second treatment zone while exposing the second treatment zone to a second plurality of laser pulses. |
地址 |
Santa Clara CA US |