发明名称 Crystallization processing for semiconductor applications
摘要 A method and apparatus for forming a crystalline semiconductor layer on a substrate are provided. A semiconductor layer is formed by vapor deposition. A pulsed laser melt/recrystallization process is performed to convert the semiconductor layer to a crystalline layer. Laser, or other electromagnetic radiation, pulses are formed into a pulse train and uniformly distributed over a treatment zone, and successive neighboring treatment zones are exposed to the pulse train to progressively convert the deposited material to crystalline material.
申请公布号 US9290858(B2) 申请公布日期 2016.03.22
申请号 US201414495533 申请日期 2014.09.24
申请人 APPLIED MATERIALS, INC. 发明人 Moffatt Stephen
分类号 C30B13/24;H01L21/02;H01L31/18;H01L21/263;H01L21/268;C30B29/40;H01L29/68;H01L33/00 主分类号 C30B13/24
代理机构 Patterson & Sheridan, LLP 代理人 Patterson & Sheridan, LLP
主权项 1. A method of treating a substrate, comprising: identifying a first treatment zone; forming a molten area of the first treatment zone by exposing a surface of the first treatment zone to a first laser pulse, wherein the first laser pulse has a non-uniformity of less than about 5 percent; recrystallizing the molten area of the first treatment zone while exposing the first treatment zone to a first plurality of laser pulses; identifying a second treatment zone; forming a molten area of the second treatment zone by exposing a surface of the second treatment zone to a second laser pulse, wherein the second laser pulse has a non-uniformity of less than about 5 percent; and recrystallizing the molten area of the second treatment zone while exposing the second treatment zone to a second plurality of laser pulses.
地址 Santa Clara CA US