Inverted optical device

摘要

Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.

主权项

1. A method comprising:
attaching a plurality of piggyback substrates to a carrier wafer using a plurality of bond layers, wherein said plurality of piggyback substrates are dissimilar in composition to said carrier wafer; processing said plurality of piggyback substrates, while attached to said carrier wafer, to produce a plurality of light emitting diodes; attaching a flip wafer to said plurality of light emitting diodes, away from said carrier wafer; and removing only said carrier wafer and plurality of bond layers.