Lead frame with mold lock structure

摘要

A lead frame for a semiconductor device includes a die paddle and leads situated on a perimeter of the lead frame. The die paddle has a metal frame and a number of substantially linear metal connecting bars within the frame. The connecting bars interconnect different locations of the frame to form a multiple triangles, where a triangular-shaped cavity is formed within each triangle. An overall area of the cavities is greater than an overall area of the connecting bars.

主权项

1. A semiconductor device, comprising:
a lead frame comprising:
a die paddle having a metal frame and a plurality of substantially linear metal connecting bars within the metal frame that interconnect different locations of the metal frame to form a plurality of triangles, wherein a triangular-shaped cavity is formed within each triangle; anda plurality of metal leads spaced from and surrounding the die paddle; an integrated circuit (IC) die mounted on the die paddle; bond wires electrically connecting the IC die to the leads; and a molding compound encapsulating an upper surface of the lead frame, the bond wires, an upper portion of the die, and filling the triangular-shaped cavities, wherein: the IC die is mounted over at least one of the triangular-shaped cavities such that a portion of the at least one triangular-shaped cavity is left uncovered by the IC die; and the molding compound fills volume under the IC die via the uncovered portion of the at least one triangular-shaped cavity.