CONTINUOUS PLATING APPARATUS AND CONTINUOUS PLATING METHOD

摘要

The present invention relates to a continuous plating apparatus comprising: a cathode roller where at least an outer surface has electric conductivity and the outer surface contacts a plated material; a first power source which applies cathode electricity to the outer surface by being electrically connected to the outer surface of the cathode roller; a spraying unit located separately from the cathode roller, spraying a plating solution including anode ions to a direction of the plated material; and a first storage tank connected to the spraying unit providing the plating solution to the spraying unit, and a continuous plating method. The continuous plating apparatus of the present invention maximizes plating efficiency by widening a plating area, and also by reducing a plating time.