| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a package part having a semiconductor element sealed in resin, a plurality of first leads each having an outer portion extending from a first side of the package part, and a plurality of second leads each having an outer portion extending from a second side of the package part. A combined bottom surface area of the outer portions of the plurality of first leads is greater than a combined bottom surface area of the outer portions of the plurality of second leads. The semiconductor device also includes a heat dissipation plate provided on the bottom surface of the package part and connected to at least one of the plurality of second leads. |
| 申请公布号 |
US2016079147(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514635938 |
申请日期 |
2015.03.02 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SHIMADA Eiji;OOKURA Gentaro;INAGI Hiroyuki |
| 分类号 |
H01L23/495;H01L23/31 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a package part including a semiconductor element sealed with resin; a plurality of first leads each having an outer portion extending from a first side of the package part; a plurality of second leads each having an outer portion extending from a second side of the package part, the second side opposing the first side; and a heat dissipation plate provided at a bottom surface of the package part and connected to at least one of the plurality of second leads, wherein the outer portions of the plurality of first leads have a combined bottom surface area that is greater than a combined bottom surface area of the outer portions of the plurality of second leads. |
| 地址 |
Tokyo JP |
