| 发明名称 |
PROCESSING MODULE, PROCESSING APPARATUS, AND PROCESSING METHOD |
| 摘要 |
PROBLEM;An upper treatment module performs polishing treatment by, while bringing a pad smaller in diameter than a wafer into contact with the wafer, relatively moving the wafer and the pad.;MEANS FOR SOLVING;The upper treatment module includes a state detecting section configured to detect states of a polishing treatment surface of the wafer before the polishing treatment or during the polishing treatment and a control section configured to control conditions of the polishing treatment in a portion of the surface of the wafer according to the states of the polishing treatment surface detected by the state detecting section. |
| 申请公布号 |
US2016074988(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514849500 |
申请日期 |
2015.09.09 |
| 申请人 |
EBARA CORPORATION |
发明人 |
YAMAGUCHI Kuniaki;MIZUNO Toshio;KOBATA Itsuki |
| 分类号 |
B24B37/005;B24B49/12;H01L21/66;H01L21/67;H01L21/306;B24B49/10;B24B49/02 |
主分类号 |
B24B37/005 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A treatment module for performing polishing treatment by, while bringing a pad smaller in diameter than a treatment target object into contact with the treatment target object, relatively moving the treatment target object and the pad, the treatment module comprising:
a state detecting section configured to detect states of a surface of the treatment target object before the polishing treatment or during the polishing treatment; and a control section configured to control conditions of the polishing treatment in a portion of the polishing treatment surface of the treatment target object according to the states of the surface detected by the state detecting section. |
| 地址 |
Tokyo JP |
