| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes an insulating substrate having a circuit plate on a principal surface thereof; a semiconductor element fixed to the circuit plate; an external terminal having one end fixed to the circuit plate; and a printed circuit board facing the principal surface of the insulating substrate, and having a through-hole for passing through the external terminal. A rigidity of a peripheral region of the through-hole is lower than a rigidity of other regions. |
| 申请公布号 |
US2016079133(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514933449 |
申请日期 |
2015.11.05 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
NASHIDA Norihiro;NAKAMURA Yoko |
| 分类号 |
H01L23/053;H01L23/08 |
主分类号 |
H01L23/053 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
an insulating substrate having a circuit plate on a principal surface thereof; a semiconductor element fixed to the circuit plate; an external terminal having one end fixed to the circuit plate; and a printed circuit board facing the principal surface of the insulating substrate, and having a through-hole for passing through the external terminal, wherein a rigidity of a peripheral region of the through-hole is lower than a rigidity of other regions. |
| 地址 |
Kawasaki-shi JP |
