| 摘要 |
A pressure sensor and a manufacturing method therefor. The pressure sensor comprises a housing (1), air lead-in holes (4), pressure lead-in holes (3), an inner cavity (10), a sensor chip (7), a lead frame (2), and a cover plate (9). The housing (1), the pressure lead-in holes (3) and the inner cavity (10) are integrally formed by means of an injection molding process. One end of each air lead-in hole (4) is in communication with the inner cavity (10) of the housing (1), and the other end of each air lead-in hole (4) is in communication with the air. The pressure lead-in holes (3) are perpendicularly disposed in the center of the upper surface of the housing (1). Two steps are disposed on the upper surface of the inner cavity (10). A horizontal surface-mounted device surface (26) is disposed on each of the steps. The sensor chip (7) is adhered on the horizontal upper surface of the inner cavity (10) of the housing (1) in an inverted manner by means of adhesives. The center of the sensor chip (7) is aligned with the centers of the pressure lead-in holes (3). Lower ends of the pressure lead-in holes (3) are in communication with the cavity (14) of the sensor chip (7). The lead frame (2) is tightly adhered with the housing (1) in the process of injection molding curing of the housing (1). A bonding pad (17) of the lead frame (2) is disposed on each of the steps in the inner cavity (10). The sensor chip (7) and the lead frame (2) are electrically connected in a gold wire bonding manner. The cover plate (9) is adhered with the bottom of the housing (1) by means of adhesives. |
