SEMICONDUCTOR PACKAGE STRUCTURE

摘要

The present disclosure relates to a semiconductor package structure, including a die and a package substrate. The die includes a semiconductor substrate, multiple interconnect metal layers, and at least one inter-level dielectric disposed between ones of the interconnect metal layers. Each inter-level dielectric is formed of a low k material. An outermost interconnect metal layer has multiple first conductive segments exposed from a surface of the inter-level dielectric. The package substrate includes a substrate body and multiple second conductive segments exposed from a surface of the substrate body. The second conductive segments are electrically connected to the first conductive segments.

主权项

1. A semiconductor package structure, comprising:
a die, comprising:
a semiconductor substrate;a plurality of interconnect metal layers, disposed adjacent to a surface of the semiconductor substrate; andat least one inter-level dielectric disposed between ones of the plurality of interconnect metal layers, each inter-level dielectric being formed of a low k material;wherein an outermost interconnect metal layer includes a plurality of first conductive segments exposed from a surface of the inter-level dielectric for external connections; and a package substrate, comprising:
a substrate body; anda plurality of second conductive segments disposed adjacent to a surface of the substrate body and exposed from the surface of the substrate body, wherein the second conductive segments are electrically connected to corresponding ones of the first conductive segments.