ELECTROSTATIC CHUCK MECHANISM, SUBSTRATE PROCESSING METHOD AND SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS

摘要

An electrostatic chuck mechanism that adsorbs a semiconductor substrate includes a stage of a flat plate shape, an electrode provided in the stage, and generating an electrostatic force, a gas supply section provided in the stage, supplying gas to an upper surface of the stage, and performing temperature adjustment of a lower surface of the semiconductor substrate, a temperature adjustment section performing temperature adjustment of the gas at the time of adsorbing the semiconductor substrate, and, a substrate vertically moving mechanism provided in the stage, and vertically moving the semiconductor substrate.

主权项

1. An electrostatic chuck mechanism that adsorbs a semiconductor substrate, comprising:
a stage of a flat plate shape; an electrode provided in the stage, and generating an electrostatic force, a gas supply section provided in the stage, supplying gas to an upper surface of the stage, and performing temperature adjustment of a lower surface of the semiconductor substrate; a temperature adjustment section performing temperature adjustment of the gas at the time of adsorbing the semiconductor substrate; and a substrate vertically moving mechanism provided in the stage, and vertically moving the semiconductor substrate.