| 摘要 |
An intermediate connection layer 4 is disposed between a wiring board and an electronic component. The intermediate connection layer 4 is provided with: a flexible portion 9 mainly made of bendable material; and a first and second rigid portions 10, 11 mainly made of rigid material sandwiching the flexible portion. On principal surfaces of the rigid portions 10, 11, first to fourth connection electrodes 14a, 14b, 22a, and 22b are formed. Each of the first and second rigid portions 10, 11 is divided in two, forming an opening 13 in the gap. On one principal surface of the flexible portion 9, a conductor portion 17 electrically connecting the connection electrodes is formed. The conductor portion 17 has a fuse portion 12 formed in a narrowed shape, and the fuse portion 12 is disposed inside the opening 13. Thus, there is provided an electronic device capable of ensuring desired fuse function with good fusing property without causing an increase in size of the device per se. |
