Method for Manufacturing Piezoelectric Device, Piezoelectric Device, and Piezoelectric Self-Supporting Substrate

摘要

A piezoelectric substrate 22 and a support substrate 27 are prepared (a), these are joined to each other with an adhesive layer 26 therebetween to form a composite substrate 20 (b), and a surface of the piezoelectric substrate 22 is polished to thin the piezoelectric substrate 22 (c). Then, grooves 28 dividing the piezoelectric substrate 22 into parts having a size for a piezoelectric device are formed by half-dicing the composite substrate 20 (d). By forming the grooves 28, the adhesive layer 26 is exposed in the grooves 28. By immersing the composite substrate in solvent, the adhesive layer 26 is removed by the solvent, and the piezoelectric substrate 22 is detached from the support substrate (e), (f), and a piezoelectric device 10 is obtained using the detached piezoelectric substrate 12 (g).

主权项

1. A method for manufacturing a piezoelectric device, comprising the steps of:
(a) preparing a piezoelectric substrate and a support substrate; (b) bonding the piezoelectric substrate and the support substrate with an adhesive layer therebetween to form a composite substrate; (c) polishing a surface of the piezoelectric substrate on the side opposite to a joint surface with the support substrate to thin the piezoelectric substrate; (d) dicing the composite substrate or half-dicing the composite substrate from the surface of the piezoelectric substrate on the side opposite to the joint surface with the support substrate and thereby dividing the piezoelectric substrate into parts having a size for a piezoelectric device; (e) immersing the composite substrate after the dicing or the half dicing is performed in solvent, thereby removing the adhesive layer using the solvent, and detaching the piezoelectric substrate from the support substrate; and (f) obtaining a piezoelectric device using the piezoelectric substrate detached from the support substrate.