APPARATUS FOR BONDING SEMICONDUCTOR CHIPS

摘要

A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.

主权项

1. A semiconductor chip bonding apparatus, comprising:
a bonding head to adsorptively pick up a semiconductor chip; a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage; a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip; a second camera to capture an image of the substrate and to obtain positional information regarding the substrate; a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip; and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.