| 发明名称 |
WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE |
| 摘要 |
A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency. |
| 申请公布号 |
US2016079198(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201414584463 |
申请日期 |
2014.12.29 |
| 申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Lin Wei-Sheng;Chiang Lien-Chen;Hung Lung-Tang;Yeh Meng-Hung;Chu Yude |
| 分类号 |
H01L23/00;B23K20/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1: A wire bonding device, comprising:
a carrier having a first region used for performing a wire bonding process and a second region positioned outside the first region; a bonding member for receiving a bonding wire; and a movement member for moving the bonding member to the first region of the carrier so as to perform the wire bonding process, wherein when the bonding wire is defective, the movement member and the bonding member are cooperatively operated so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier. |
| 地址 |
Taichung TW |
