MANUFACTURING OF A HEAT SINK BY WAVE SOLDERING

摘要

An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.

主权项

1. An electronic assembly, comprising:
an electronic board with a set of vias passing through the electronic board between a first surface and a second surface opposite the first surface, an electronic device attached to the first surface of the electronic board, a heat sink precursor attached to the second surface of the electronic board, the heat sink precursor defining a cavity facing the set of vias, and solder material that fills the set of vias so as to weld a back of the electronic device to the set of vias and at least partially fills the cavity of the heat sink precursor so as to join the heat sink precursor to the set of vias and form a corresponding heat sink.