| 发明名称 |
MICROPILLAR-ENABLED THERMAL GROUND PLANE |
| 摘要 |
A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed. |
| 申请公布号 |
US2016076820(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514857567 |
申请日期 |
2015.09.17 |
| 申请人 |
THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE |
发明人 |
Lewis Ryan John;Liew Li-Anne;Lin Ching-Yi;Coolidge Collin Jennings;Xu Shanshan;Yang Ronggui;Lee Yung-Cheng |
| 分类号 |
F28D15/04 |
主分类号 |
F28D15/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermal ground plane comprising:
a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate; wherein the first planar substrate and the second planar substrate are hermetically sealed. |
| 地址 |
Denver CO US |
