SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

摘要

A substrate structure is provided, including: a carrier having at least a wiring area defined and positioned on a portion of a surface of the carrier; a first insulating layer formed on the wiring area; a wiring layer formed on the first insulating layer formed on the wiring area; and a second insulating layer formed on the wiring area. Therefore, a contact surface between the carrier and the first and second insulating layers is reduced by reducing the areas of the first and second insulating layers, whereby a substrate warpage due to mismatch of coefficients of thermal expansion (CTE) is avoided. The present invention further provides a method of manufacturing the substrate structure as described above.

主权项

1. A substrate structure, comprising;
a carrier having at least a wiring area defined and positioned on a portion of a surface of the carrier; a first insulating layer formed on the at least a wiring area; a wiring layer formed on the first insulating layer; and a second insulating layer formed on the carrier.