SUPPORT SUBSTRATE, COMPOSITE SUBSTRATE, AND MANUFACTURING METHOD OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide: a support substrate which has a high efficiency and is suitably used for manufacturing a semiconductor wafer; a composite substrate including such a support substrate and a semiconductor film; and a method for manufacturing a semiconductor wafer by use of such a support substrate and a composite substrate.SOLUTION: A support substrate 11 comprises aluminum atoms, silicon atoms, and 0.001-10 mass% of an alkali-earth metal element atoms, of which the crystal phases include 35-65 mass% of a mullite phase and 35-65 mass% of an alumina phase. A composite substrate 1 comprises: a support substrate 11 as described above; and a semiconductor film 13 located on the side of a principal face 11m of the support substrate 11.SELECTED DRAWING: Figure 2