| 摘要 |
PROBLEM TO BE SOLVED: To provide: an adhesive film which has a high strength for bonding with a conductor layer and enables the formation of an interlayer insulative layer according to a build-up method; a multilayer printed wiring board; and a manufacturing method therefor.SOLUTION: An adhesive film is arranged by providing an A layer including a resin composition arranged by blending (a) a polyamide resin which dissolves in an organic solvent, (b) a thermosetting resin, (c) a filler and (d) a resin having a polysiloxane skeleton in blend proportions as described below, a B layer including a thermosetting resin composition which is solid under 40°C, and melting at a temperature between 40 and 140°C, inclusive of 40°C, and a C layer serving as a support for supporting the A layer, in the order of the C layer, the A layer and the B layer. The proportion of the component (a) to the component (b) is 1:2 to 1:20 on a mass basis. The proportion of the total mass of components (a) and (b) to the mass of the component (c) is 20:1 to 2:1. The proportion of the component (d) to the component (a) is 1:1000 to 2:5 on the mass basis. The total blend quantity of the components (a) to (d) is 70 pts.mass or more to 100 pts.mass of the resin composition.SELECTED DRAWING: None |
