| 摘要 |
Disclosed is a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer. The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) formed contacting the polyimide layer (b), wherein the polyimide layer (a) is a polyimide formed from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1):
wherein R 1 denotes a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aryl group, and R 2 denotes an alkyl group having 1 to 12 carbon atoms or an aryl group. |
