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发明名称
被加工物の分断方法および光学素子パターン付き基板の分断方法
摘要
申请公布号
JP5887929(B2)
申请公布日期
2016.03.16
申请号
JP20110288173
申请日期
2011.12.28
申请人
三星ダイヤモンド工業株式会社
发明人
法貴 哲夫;長友 正平
分类号
B23K26/364;B23K26/00;B23K26/08;B23K26/38;B28D5/00;C03B33/09;H01L21/301
主分类号
B23K26/364
代理机构
代理人
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地址
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