发明名称 Thermoelectric cooler/heater integrated in printed circuit board
摘要 A circuit board (20) is provided that includes at least one Peltier heat pump device (21) with at least one pair (22) of semiconductor members (23, 24) arranged thermally in parallel and electrically in series. The at least one pair of semiconductor members is at least partially embedded in the circuit board.
申请公布号 EP2790474(B1) 申请公布日期 2016.03.16
申请号 EP20130162954 申请日期 2013.04.09
申请人 HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH 发明人 NOSHADI, VALOD
分类号 H05K1/02;H01L35/32;H05K1/16 主分类号 H05K1/02
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