| 发明名称 |
WAFER WITH IMPROVED PLATING CURRENT DISTRIBUTION |
| 摘要 |
A semiconductor wafer is provided including a plurality of dies, each of the plurality of dies including a plurality of semiconductor devices, a plurality of die seals, each of the plurality of die seals being formed at a perimeter of one of the plurality of dies, and a plurality of electrically conductive links, each of the plurality of conductive links connecting one of the plurality of die seals with another one of the plurality of die seals. |
| 申请公布号 |
US2016079116(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201414487250 |
申请日期 |
2014.09.16 |
| 申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Werner Thomas;Aubel Oliver;Feustel Frank |
| 分类号 |
H01L21/768;H01L23/528;H01L21/56;H01L27/02 |
主分类号 |
H01L21/768 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor wafer, comprising:
a plurality of dies, each of said plurality of dies comprising a plurality of semiconductor devices; a plurality of die seals, each of said plurality of die seals being formed at a perimeter of one of said plurality of dies; and a plurality of electrically conductive links, each of said plurality of conductive links connecting one of said plurality of die seals with another one of said plurality of die seals. |
| 地址 |
Grand Cayman KY |
